Simulation of Fatigue Behavior of Nickel Plated CopperComposites Using Molecular Dynamics

Nickel plated copper is a widely used composite in electronic and aviation industries. Such a wide applicability necessitates more investigations on mechanical behavior of the material. In this regard, nano-scale fatigue damagesimulations, using molecular dynamics method. On nickel plated copper composite have been performed. The main topics of this paper are mechanical and fatigue properties of nickel coated copper plates, comparison with other metalcoatings (i.e. silver) and obtaining fatigue Paris equation components for these types of composites. In order to verify the results, first, a nickel plate is simulated and the results are compared to those of the experiments, then the fatiguesimulation of the composites is performed. To ensure the accuracy of the model, Sutton-RafiiTabar inter-atomic potential is employed to capture all properties of diverse atomic bonds.

کلیدواژه ها:

fatigue simulation ، Molecular Dynamics ، Nickel plated copper ، Paris equation