The Co/Cu Multilayer Electrodeposition

In various multilayer systems, the electrodeposited Co/Cu presents a great interest [1]. They are among those for magnetic storage devices owing very large magnetoresistance properties even at room temperature [2]. The properties of this system depend on the Co/Cu bilayer thickness, global thickness and desirable structure of multilayer. Therefore, it is important to control the electrodeposition conditions leading to formation of a super lattice structure [3]. In this case, a very low concentration of metallic ions is used for the first specie (non magnetic layer) with deposition at the lower overpotential and high concentration for the other one (magnetic layer) that is deposited at the higher overpotentials [4]. In this paper, the electrodeposition mechanism of the Co/Cu multilayer system is studied by electrochemical techniques