Investigation of Reaction between Epoxy and 4-Phenyl 1-2, 6-Bis (4- Aminophenyl) Pyridine by Using FTIR and DSC Tools

Epoxy resins are widely utilized in a number of industrial application. Some of the manyuses of epoxy resins can be found in the adhesive, coating, electronic industries due to the manyexcellent mechanical and chemical properties such as high tensile, compressive strength, goodchemical and solvent resistance and high heat distortion temperature.The non-isothermal curing reaction of system consisting of an epoxy glue and synthesized4-phenyl1-2, 6-bis (4-aminophenyl) pyridine was studied with a Fourier transform infrared(FTIR) and differential scanning calorimetry (DSC). From a kinetic study, some parameters suchas rate constants and activation energy were determined.The method, based on graphic analysis of DSC test results, has been used to study a kineticparameters. All dynamic DSC curves showed only one sharp exothermic peak, regardless of theheating rate, because the cure reaction between epoxide groups and primary or secondary aminegroups took place in the same stage.For the kinetic analysis of the curing reaction, different concentration of the curing agentwas investigated. DSC thermogram shifted to the lower temperature with increasing the amountthis material and shifted to the higher temperature with increasing heating rate.The FTIR spectroscopy is a powerful tool to monitor the kinetic reaction of this epoxy. Ascan be seen, the degree of conversion increases when the intensity of the band at 915 cm-1decrease.

کلیدواژه ها:

Epoxy ، Curing ، DSC ، FTIR ، Kinetic