Effect of thickness of thin films on mechanical properties measured by nano-indentation and comparison with molecular dynamic (MD) simulation

سال انتشار: 1392
نوع سند: مقاله کنفرانسی
زبان: انگلیسی
مشاهده: 767

فایل این مقاله در 10 صفحه با فرمت PDF قابل دریافت می باشد

استخراج به نرم افزارهای پژوهشی:

لینک ثابت به این مقاله:

شناسه ملی سند علمی:

WMECH02_101

تاریخ نمایه سازی: 21 تیر 1393

چکیده مقاله:

Thin films have become increasingly important in physics and engineering due to their uses in semiconductors, mirrors, lens coatings, and many other applications. This field will become even more vibrant as we try to make appliances and systems smaller and thinner.Nano-indentation is one of the most known methods for investigating the properties of thin films. It is a known fact that thin layers are characterized by different mechanical properties than their bulk samples. This study focuses on investigation of different thin layers by nano-indentation test with a support of molecular dynamic simulation. In order to carry out the study, thin layers of different thickness values were coated on a substrate. The coated samples were simulated in LAMMPS, molecular dynamic software, and the Young’s modulus and hardness of coatings were determined. The results were then compared with the experimental data available in literature.

نویسندگان

M. R Ayatollahi

Professor

A Rahimi

MSc Student

A Karimzadeh

Ph.D. student, Fatigue and Fracture Laboratory, Center of Excellence in Experimental Solid Mechanics and Dynamics, School of Mechanical Engineering, Iran University of Science and Technology, Tehran, Iran,

مراجع و منابع این مقاله:

لیست زیر مراجع و منابع استفاده شده در این مقاله را نمایش می دهد. این مراجع به صورت کاملا ماشینی و بر اساس هوش مصنوعی استخراج شده اند و لذا ممکن است دارای اشکالاتی باشند که به مرور زمان دقت استخراج این محتوا افزایش می یابد. مراجعی که مقالات مربوط به آنها در سیویلیکا نمایه شده و پیدا شده اند، به خود مقاله لینک شده اند :
  • Bourhis, E. Le. (2011), Vacuum 82, 1353-1359. ...
  • Zhao, M., et al. (2008), Thin Solid Films 516, 7571-7580. ...
  • Oliver, W.C., et al. (2003), J. Mater. Res. 19, 3-20. ...
  • Nili, H.. et al. (2013), Progress in Materials Science 58, ...
  • Wymysowski, A., Dowhan, L. (2013), Microelectron ics Reliability 53, 443-451. ...
  • Han, S.M., et al. (2006), Acta Materialia 54, 1571-1581. ...
  • Dowhan, L., et al. (201 1), Microelectron ics Reliability 51, ...
  • Peng, P.. et al. (2010), Applied Surface Science 256, 62846290. ...
  • Miller, R.E., et al. (2004), Acta Materialia 52, 271-284. ...
  • Zaminpayma, E. (2009), J. Clust Sci. 20, 641-649. ...
  • Shi, Y., Falk, M.L. (2005), Appl. Phys. Lett. 86, 011914. ...
  • Dasilva, J., RINO, P. (2012), Computational Materials Science 62, 1-5. ...
  • Zhu, P., et al. (2012), Applied Surface Science 258, 46244631. ...
  • Lichinchi, M., et al. (1998), Thin Solid Films 333, 278-286. ...
  • Ziegenhain, G., et al. (2009), Mech. Phys. Solids 57, 1514-1526. ...
  • Tersoff, J. (1989), Phys. Rev. 39, 556. ...
  • Yan, Y., et al. (2007), Computational Materials Science 40, 1-5. ...
  • Fang, T.. Wu, J. (2008), Computational Materials Science 43, 785-790. ...
  • Karimzadeh, A., et al. (2014), Computational Materials Science 81, 595-600. ...
  • Panich, N., Yong, S. (2005), KMITL Sci. J. 5, 2. ...
  • نمایش کامل مراجع